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Failure and stress analysis of Cu TSVs using

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorHerms, Martin
dc.contributor.authorWagner, Matthias
dc.contributor.authorDjuric, Tatjana
dc.contributor.authorCzurratis, Peter
dc.contributor.authorBrand, Sebastian
dc.date.accessioned2021-10-22T18:53:37Z
dc.date.available2021-10-22T18:53:37Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25160
dc.sourceIIOimport
dc.titleFailure and stress analysis of Cu TSVs using
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.source.peerreviewyes
dc.source.beginpage119
dc.source.endpage25
dc.source.conference41st International Symposium for Testing and Failure Analysis - ISTFA
dc.source.conferencedate1/11/2015
dc.source.conferencelocationPortland USA
imec.availabilityPublished - imec
imec.internalnotesEISBN: 978-1-62708-103-0


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