dc.contributor.author | Degraeve, Robin | |
dc.contributor.author | Fantini, Andrea | |
dc.contributor.author | Roussel, Philippe | |
dc.contributor.author | Goux, Ludovic | |
dc.contributor.author | Costantino, A. | |
dc.contributor.author | Chen, Michael | |
dc.contributor.author | Clima, Sergiu | |
dc.contributor.author | Govoreanu, Bogdan | |
dc.contributor.author | Linten, Dimitri | |
dc.contributor.author | Thean, Aaron | |
dc.contributor.author | Jurczak, Gosia | |
dc.date.accessioned | 2021-10-22T18:55:47Z | |
dc.date.available | 2021-10-22T18:55:47Z | |
dc.date.issued | 2015 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25172 | |
dc.source | IIOimport | |
dc.title | Quantitive endurance failure model for filamentary RRAM | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Degraeve, Robin | |
dc.contributor.imecauthor | Fantini, Andrea | |
dc.contributor.imecauthor | Roussel, Philippe | |
dc.contributor.imecauthor | Goux, Ludovic | |
dc.contributor.imecauthor | Clima, Sergiu | |
dc.contributor.imecauthor | Govoreanu, Bogdan | |
dc.contributor.imecauthor | Linten, Dimitri | |
dc.contributor.imecauthor | Thean, Aaron | |
dc.contributor.imecauthor | Jurczak, Gosia | |
dc.contributor.orcidimec | Roussel, Philippe::0000-0002-0402-8225 | |
dc.contributor.orcidimec | Goux, Ludovic::0000-0002-1276-2278 | |
dc.contributor.orcidimec | Clima, Sergiu::0000-0002-4044-9975 | |
dc.contributor.orcidimec | Linten, Dimitri::0000-0001-8434-1838 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 188 | |
dc.source.endpage | 189 | |
dc.source.conference | IEEE Symposium on VLSI Technology | |
dc.source.conferencedate | 15/06/2015 | |
dc.source.conferencelocation | Kyoto Japan | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7223673 | |
imec.availability | Published - imec | |