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Cobalt UBM for fine pitch microbump applications in 3DIC

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDe Preter, Inge
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorDictus, Dries
dc.contributor.authorDi Piazza, Luca
dc.contributor.authorHou, Lin
dc.contributor.authorGuerrieri, Stefano
dc.contributor.authorVakanas, George
dc.contributor.authorArmini, Silvia
dc.contributor.authorDaily, Robert
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVandelaer, Yannick
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T18:59:33Z
dc.date.available2021-10-22T18:59:33Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25192
dc.sourceIIOimport
dc.titleCobalt UBM for fine pitch microbump applications in 3DIC
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorDi Piazza, Luca
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage221
dc.source.endpage224
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325652
imec.availabilityPublished - open access


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