Show simple item record

Stress and bowing engineering in passive silicon interposer

dc.contributor.authorDetalle, Mikael
dc.contributor.authorVandevelde, Bart
dc.contributor.authorNolmans, Philip
dc.contributor.authorMiller, Andy
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T19:00:31Z
dc.date.available2021-10-22T19:00:31Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25197
dc.sourceIIOimport
dc.titleStress and bowing engineering in passive silicon interposer
dc.typeProceedings paper
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage287
dc.source.endpage292
dc.source.conferenceIEEE 65th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159606
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
30524.pdf
Size:
1.619Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record