Ni/Cu plated n-Si rear junction cells with efficiencies up to 22%?(and above)

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Authors
Duerinckx, Filip; Uruena De Castro, Angel; Aleman, Monica; Cornagliotti, Emanuele; Sharma, Aashish; Choulat, Patrick; Tous, Loic; Recaman Payo, Maria; Kuzma Filipek, Izabela; Hajjiah, Ali; Dang Thi Thuy, Chi; Russell, Richard; Haslinger, Michael; John, Joachim; Szlufcik, Jozef
Conference
nPV Workshop
Title
Ni/Cu plated n-Si rear junction cells with efficiencies up to 22%?(and above)
Publication type
Oral presentation
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