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An efficient bump pad design to mitigate the flip chip package induced stress

dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T19:27:07Z
dc.date.available2021-10-22T19:27:07Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25324
dc.sourceIIOimport
dc.titleAn efficient bump pad design to mitigate the flip chip package induced stress
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage7
dc.source.conferenceInterPACK & ICNNM
dc.source.conferencedate6/07/2015
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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