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Development of glyoxylic acid based electroless copper deposition on ruthenium

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorArmini, Silvia
dc.contributor.authorStruyf, Herbert
dc.contributor.authorShingubara, Shoso
dc.contributor.authorTanaka, Tetsu
dc.date.accessioned2021-10-22T19:50:33Z
dc.date.available2021-10-22T19:50:33Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25414
dc.sourceIIOimport
dc.titleDevelopment of glyoxylic acid based electroless copper deposition on ruthenium
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage41
dc.source.endpage55
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
dc.source.conferencedate5/10/2014
dc.source.conferencelocationCancun Mexico
dc.identifier.urlhttp://ecst.ecsdl.org/content/64/40/41.full.pdf
imec.availabilityPublished - imec
imec.internalnotesECS Transactions; Vol. 64, Issue 40


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