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Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorArmini, Silvia
dc.contributor.authorStruyf, Herbert
dc.contributor.authorShingubara, Shoso
dc.contributor.authorTanaka, Tetsu
dc.date.accessioned2021-10-22T19:50:50Z
dc.date.available2021-10-22T19:50:50Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25415
dc.sourceIIOimport
dc.titleGlyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage63
dc.source.endpage75
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
dc.source.conferencedate5/10/2014
dc.source.conferencelocationCancun Mexico
dc.identifier.urlhttp://ecst.ecsdl.org/content/64/40/63.full.pdf
imec.availabilityPublished - imec
imec.internalnotesECS Transaction; Vol. 64, Issue 40


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