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Effect of CMP slurry filtration on wafer defectivity

dc.contributor.authorDevriendt, Katia
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVrancken, Evi
dc.contributor.authorGrillaert, Joost
dc.contributor.authorHeyns, Marc
dc.contributor.authorLing, Zhi Ming
dc.date.accessioned2021-09-30T11:51:25Z
dc.date.available2021-09-30T11:51:25Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2545
dc.sourceIIOimport
dc.titleEffect of CMP slurry filtration on wafer defectivity
dc.typeOral presentation
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVrancken, Evi
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.source.peerreviewno
dc.source.conferenceMRS Spring Meeting 1998. Symposium Q: Materials Issues in Chemical-Mechanical Polishing; April 15-16, 1998; San Francisco, Calif
dc.source.conferencelocation
imec.availabilityPublished - imec


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