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Relation between oxide-CMP induced defects and post-CMP cleaning strategies

dc.contributor.authorDevriendt, Katia
dc.contributor.authorVrancken, Evi
dc.contributor.authorHeylen, Nancy
dc.contributor.authorGrillaert, Joost
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.contributor.authorLing, Zhi Ming
dc.date.accessioned2021-09-30T11:51:38Z
dc.date.available2021-09-30T11:51:38Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2546
dc.sourceIIOimport
dc.titleRelation between oxide-CMP induced defects and post-CMP cleaning strategies
dc.typeOral presentation
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorVrancken, Evi
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.source.peerreviewno
dc.source.conference4th International Symposium on Ultra Clean Processing of Silicon Surfaces - UCPSS
dc.source.conferencedate21/09/1998
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - imec
imec.internalnotesPubl. in 1999; Zie C3380


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