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Effect of 4-point bending test procedure on crack propagation in thin film stacks

dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanstreels, Kris
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorHecker, Michael
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-22T20:09:47Z
dc.date.available2021-10-22T20:09:47Z
dc.date.issued2015
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25478
dc.sourceIIOimport
dc.titleEffect of 4-point bending test procedure on crack propagation in thin film stacks
dc.typeJournal article
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage59
dc.source.endpage63
dc.source.journalMicroelectronic Engineering
dc.source.volume137
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931714003724
imec.availabilityPublished - open access


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