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Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias
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Authors
Kosemura, Daisuke
;
De Wolf, Ingrid
ISSN
0003-6951
Issue
19
Journal
Applied Physics Letters
Volume
106
Title
Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias
Publication type
Journal article
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