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Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias

dc.contributor.authorKosemura, Daisuke
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-22T20:12:43Z
dc.date.available2021-10-22T20:12:43Z
dc.date.issued2015
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25487
dc.sourceIIOimport
dc.titleThree-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage191901
dc.source.journalApplied Physics Letters
dc.source.issue19
dc.source.volume106
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/apl/106/19/10.1063/1.4921004
imec.availabilityPublished - imec


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