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3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications

dc.contributor.authorMaggioni, Federica
dc.contributor.authorOprins, Herman
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-22T20:46:50Z
dc.date.available2021-10-22T20:46:50Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25592
dc.sourceIIOimport
dc.title3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage107
dc.source.endpage112
dc.source.conference31st Semiconductor Thermal Measurement and Management Symposium - SEMI-THERM
dc.source.conferencedate15/03/2015
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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