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A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking

dc.contributor.authorMiller, Andy
dc.contributor.authorHaensel, Leander
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorBeyne, Eric
dc.contributor.authorWiesiollek, Markus
dc.contributor.authorEisenbach, Heiko
dc.contributor.authorFilzen, Marc
dc.contributor.authorWen, Youxian
dc.contributor.authorSood, Sumant
dc.date.accessioned2021-10-22T21:05:50Z
dc.date.available2021-10-22T21:05:50Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25645
dc.sourceIIOimport
dc.titleA study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking
dc.typeProceedings paper
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conference13th International Wafer Level Packaging Conference - IWLPC
dc.source.conferencedate13/10/2015
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://www.iwlpc.com/papers/presentations/Ng_Jenny_1.pdf
imec.availabilityPublished - imec


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