dc.contributor.author | Oba, Yoshiyuki | |
dc.contributor.author | De Messemaeker, Joke | |
dc.contributor.author | Tyrovouzi, Anna-Maria | |
dc.contributor.author | Miyamori, Yuichi | |
dc.contributor.author | De Vos, Joeri | |
dc.contributor.author | Wang, Teng | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Croes, Kristof | |
dc.date.accessioned | 2021-10-22T21:25:38Z | |
dc.date.available | 2021-10-22T21:25:38Z | |
dc.date.issued | 2015 | |
dc.identifier.issn | 0021-4922 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25698 | |
dc.source | IIOimport | |
dc.title | Effect of test structure on electromigration characteristics in 3D-TSV stacked devices | |
dc.type | Journal article | |
dc.contributor.imecauthor | De Messemaeker, Joke | |
dc.contributor.imecauthor | De Vos, Joeri | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 05EE01 | |
dc.source.journal | Japanese Journal of Applied Physics | |
dc.source.issue | 5S | |
dc.source.volume | 54 | |
dc.identifier.url | http://m.iopscience.iop.org/1347-4065/54/5S/05EE01/pdf/1347-4065_54_5S_05EE01.pdf | |
imec.availability | Published - imec | |