Enabling pre-sssembly process of 3D wafers with high topography at the backside

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Authors
Podpod, Arnita; Demeurisse, Caroline; Inoue, Fumihiro; Duval, Fabrice; Visker, Jakob; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric
Conference
17th Electronics Packaging Technology Conference - EPTC
Title
Enabling pre-sssembly process of 3D wafers with high topography at the backside
Publication type
Proceedings paper
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