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Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process

dc.contributor.authorGao, Teng
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMeynen, Herman
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-09-30T11:58:27Z
dc.date.available2021-09-30T11:58:27Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2578
dc.sourceIIOimport
dc.titleIntegration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
dc.typeOral presentation
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate6/10/1998
dc.source.conferencelocationColorado Springs, CO USA
imec.availabilityPublished - open access


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