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Die thickness impact on thermo-mechanical stress in 3D packages

dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorOprins, Herman
dc.date.accessioned2021-10-22T22:29:22Z
dc.date.available2021-10-22T22:29:22Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25853
dc.sourceIIOimport
dc.titleDie thickness impact on thermo-mechanical stress in 3D packages
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorOprins, Herman
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage6
dc.source.conference16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate19/04/2015
dc.source.conferencelocationBudapest Hungary
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7103104
imec.availabilityPublished - open access


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