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Optimization of through Si via last microlithography for 3D packaging

dc.contributor.authorSlabbekoorn, John
dc.contributor.authorTobback, Bert
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorMiller, Andy
dc.contributor.authorFlack, Warren
dc.contributor.authorHsieh, Robert
dc.contributor.authorKenyon, Gareth
dc.date.accessioned2021-10-22T23:00:47Z
dc.date.available2021-10-22T23:00:47Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25924
dc.sourceIIOimport
dc.titleOptimization of through Si via last microlithography for 3D packaging
dc.typeProceedings paper
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorTobback, Bert
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorMiller, Andy
dc.source.peerreviewno
dc.source.conference13th International Wafer-Level Packaging Workshop - IWLPC
dc.source.conferencedate13/10/2015
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://www.iwlpc.com/files/IWLPC-2015-Program.pdf
imec.availabilityPublished - imec


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