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Yield improvement for 3D wafer-to-wafer stacked ICs using wafer matching

dc.contributor.authorTaouil, Mottaqiallah
dc.contributor.authorHamdioui, Said
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-22T23:27:34Z
dc.date.available2021-10-22T23:27:34Z
dc.date.issued2015
dc.identifier.issn1084-4309
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25982
dc.sourceIIOimport
dc.titleYield improvement for 3D wafer-to-wafer stacked ICs using wafer matching
dc.typeJournal article
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage19
dc.source.journalACM Transactions on Design Automation of Electronic Systems
dc.source.issue2
dc.source.volume20
dc.identifier.urlhttp://dl.acm.org/citation.cfm?id=2699832
imec.availabilityPublished - imec


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