dc.contributor.author | Taouil, Mottaqiallah | |
dc.contributor.author | Hamdioui, Said | |
dc.contributor.author | Marinissen, Erik Jan | |
dc.date.accessioned | 2021-10-22T23:27:34Z | |
dc.date.available | 2021-10-22T23:27:34Z | |
dc.date.issued | 2015 | |
dc.identifier.issn | 1084-4309 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25982 | |
dc.source | IIOimport | |
dc.title | Yield improvement for 3D wafer-to-wafer stacked ICs using wafer matching | |
dc.type | Journal article | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 19 | |
dc.source.journal | ACM Transactions on Design Automation of Electronic Systems | |
dc.source.issue | 2 | |
dc.source.volume | 20 | |
dc.identifier.url | http://dl.acm.org/citation.cfm?id=2699832 | |
imec.availability | Published - imec | |