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Tackling CMP challenges related to the integration of III-V materials for <10nm node applications

dc.contributor.authorTeugels, Lieve
dc.contributor.authorOng, Patrick
dc.contributor.authorWaldron, Niamh
dc.contributor.authorBoccardi, Guillaume
dc.date.accessioned2021-10-22T23:30:13Z
dc.date.available2021-10-22T23:30:13Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25988
dc.sourceIIOimport
dc.titleTackling CMP challenges related to the integration of III-V materials for <10nm node applications
dc.typeProceedings paper
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.source.peerreviewyes
dc.source.conferenceSemicon Korea
dc.source.conferencedate4/02/2015
dc.source.conferencelocationSeoul Korea
imec.availabilityPublished - imec


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