Show simple item record

Comparison between wet and dry silicon via reveal in 3D backside processing

dc.contributor.authorThomas, Dave
dc.contributor.authorHopkins, Janet
dc.contributor.authorAshraf, Huma
dc.contributor.authorPatel, Jash
dc.contributor.authorAnsell, Oliver
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T23:32:25Z
dc.date.available2021-10-22T23:32:25Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25992
dc.sourceIIOimport
dc.titleComparison between wet and dry silicon via reveal in 3D backside processing
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conference12th Annual International Wafer Level Packaging Workshop - IWLPC
dc.source.conferencedate13/10/2015
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record