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Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects

dc.contributor.authorVakanas, George
dc.contributor.authorO, Minho
dc.contributor.authorDimcic, Biljana
dc.contributor.authorVanstreels, Kris
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorKajihara, Masanori
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T23:51:32Z
dc.date.available2021-10-22T23:51:32Z
dc.date.issued2015
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26031
dc.sourceIIOimport
dc.titleFormation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage72
dc.source.endpage80
dc.source.journalMicroelectronic Engineering
dc.source.volume140
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931715003640
imec.availabilityPublished - imec


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