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Processing active devices on Si interposer and impact on cost

dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDetalle, Mikael
dc.contributor.authorHellings, Geert
dc.contributor.authorScholz, Mirko
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorMiller, Andy
dc.contributor.authorLinten, Dimitri
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T00:30:38Z
dc.date.available2021-10-23T00:30:38Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26116
dc.sourceIIOimport
dc.titleProcessing active devices on Si interposer and impact on cost
dc.typeProceedings paper
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpageTS11.2
dc.source.conferenceIEEE International 3D Systems Integration Conference - 3DIC
dc.source.conferencedate31/08/2015
dc.source.conferencelocationSendai Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7334620
imec.availabilityPublished - imec


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