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Direct etched Cu characterization for advanced interconnects

dc.contributor.authorWen, Liang Gong
dc.contributor.authorYamashita, Fumiko
dc.contributor.authorTang, Baojun
dc.contributor.authorCroes, Kristof
dc.contributor.authorTahara, Shigeru
dc.contributor.authorShimoda, Keiichi
dc.contributor.authorMaeshiro, Takeru
dc.contributor.authorNishimura, Eiichi
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorCiofi, Ivan
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-23T00:59:34Z
dc.date.available2021-10-23T00:59:34Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26174
dc.sourceIIOimport
dc.titleDirect etched Cu characterization for advanced interconnects
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage173
dc.source.endpage176
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325613
imec.availabilityPublished - open access


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