dc.contributor.author | Zahedmanesh, Houman | |
dc.contributor.author | Vanstreels, Kris | |
dc.contributor.author | Gonzalez, Mario | |
dc.date.accessioned | 2021-10-23T01:27:19Z | |
dc.date.available | 2021-10-23T01:27:19Z | |
dc.date.issued | 2015 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26227 | |
dc.source | IIOimport | |
dc.title | Numerical simulation of nano-indentation induced fracture of low-k dielectric thin films using cube corner indenter | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Zahedmanesh, Houman | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 75 | |
dc.source.endpage | 78 | |
dc.source.conference | IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM | |
dc.source.conferencedate | 18/05/2015 | |
dc.source.conferencelocation | Grenoble France | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325630 | |
imec.availability | Published - open access | |