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Numerical simulation of nano-indentation induced fracture of low-k dielectric thin films using cube corner indenter

dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVanstreels, Kris
dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-23T01:27:19Z
dc.date.available2021-10-23T01:27:19Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26227
dc.sourceIIOimport
dc.titleNumerical simulation of nano-indentation induced fracture of low-k dielectric thin films using cube corner indenter
dc.typeProceedings paper
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage75
dc.source.endpage78
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325630
imec.availabilityPublished - open access


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