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Alternative integration of ultra low-k dielectrics by template replacement approach

dc.contributor.authorZhang, Liping
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorHeylen, Nancy
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-23T01:32:58Z
dc.date.available2021-10-23T01:32:58Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26238
dc.sourceIIOimport
dc.titleAlternative integration of ultra low-k dielectrics by template replacement approach
dc.typeProceedings paper
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage345
dc.source.endpage347
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325596
imec.availabilityPublished - open access


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