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Low-damage cryogenic etch of porous organosilicate low-k dielectric

dc.contributor.authorZhang, Liping
dc.contributor.authorGoodyear, Andy
dc.contributor.authorCooke, Mike
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-23T01:35:08Z
dc.date.available2021-10-23T01:35:08Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26242
dc.sourceIIOimport
dc.titleLow-damage cryogenic etch of porous organosilicate low-k dielectric
dc.typeMeeting abstract
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpagena
dc.source.conferenceMicro-Nano Engineering Conference - MNE
dc.source.conferencedate21/09/2015
dc.source.conferencelocationDelft Nederland
dc.identifier.urlhttp://mne2015.org/wp-content/uploads/2015/09/pdf/Thu-B2-c4.pdf
imec.availabilityPublished - open access


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