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The impact of PEALD TaN barrier processes on different ultra low-k dielectrics

dc.contributor.authorZhang, Xunyuan
dc.contributor.authorGillot, Christophe
dc.contributor.authorZhao, Larry
dc.contributor.authorRyan, E. Todd
dc.contributor.authorWu, Chen
dc.date.accessioned2021-10-23T01:35:38Z
dc.date.available2021-10-23T01:35:38Z
dc.date.issued2015
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26243
dc.sourceIIOimport
dc.titleThe impact of PEALD TaN barrier processes on different ultra low-k dielectrics
dc.typeJournal article
dc.contributor.imecauthorWu, Chen
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.source.peerreviewyes
dc.source.beginpageN160
dc.source.endpageN162
dc.source.journalECS Journal of Solid State Science and Technology
dc.source.issue12
dc.source.volume4
dc.identifier.urlhttp://jss.ecsdl.org/content/4/12/N160.abstract
imec.availabilityPublished - imec


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