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Flip-chip-joined 8x8-nm light-emitting diodes for interconnect applications

dc.contributor.authorHeremans, Paul
dc.contributor.authorMerken, Patrick
dc.contributor.authorGenoe, Jan
dc.contributor.authorWindisch, Reiner
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBorghs, Gustaaf
dc.date.accessioned2021-09-30T12:10:49Z
dc.date.available2021-09-30T12:10:49Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2630
dc.sourceIIOimport
dc.titleFlip-chip-joined 8x8-nm light-emitting diodes for interconnect applications
dc.typeProceedings paper
dc.contributor.imecauthorHeremans, Paul
dc.contributor.imecauthorGenoe, Jan
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.orcidimecGenoe, Jan::0000-0002-4019-5979
dc.source.peerreviewno
dc.source.beginpage10
dc.source.endpage15
dc.source.conferenceOptoelectronic Interconnects V;
dc.source.conferencelocation
imec.availabilityPublished - imec
imec.internalnotes


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