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Application of self assembled monolayers to the electroless metallization of high aspect ratio vias for microelectronics

dc.contributor.authorBernasconi, Roberto
dc.contributor.authorHosseini, Molazem
dc.contributor.authorCervati, Michele
dc.contributor.authorArmini, Silvia
dc.contributor.authorMagagnin, Luca
dc.date.accessioned2021-10-23T10:06:52Z
dc.date.available2021-10-23T10:06:52Z
dc.date.issued2016
dc.identifier.issn0361-5235
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26335
dc.sourceIIOimport
dc.titleApplication of self assembled monolayers to the electroless metallization of high aspect ratio vias for microelectronics
dc.typeJournal article
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.identifier.doi10.1007/s11664-016-4753-5
dc.source.peerreviewyes
dc.source.beginpage5449
dc.source.endpage5455
dc.source.journalJournal of Electronic Materials
dc.source.issue10
dc.source.volume45
imec.availabilityPublished - imec


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