Authors

Bernasconi, Roberto; Hosseini, Molazem; Cervati, Michele; Armini, Silvia; Magagnin, Luca

DOI

10.1007/s11664-016-4753-5

ISSN

0361-5235

Issue

10

Journal

Journal of Electronic Materials

Volume

45

Title

Application of self assembled monolayers to the electroless metallization of high aspect ratio vias for microelectronics

Publication type

Journal article