Application of self assembled monolayers to the electroless metallization of high aspect ratio vias for microelectronics

dc.contributor.author	Bernasconi, Roberto
dc.contributor.author	Hosseini, Molazem
dc.contributor.author	Cervati, Michele
dc.contributor.author	Armini, Silvia
dc.contributor.author	Magagnin, Luca
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.date.accessioned	2021-10-23T10:06:52Z
dc.date.available	2021-10-23T10:06:52Z
dc.date.issued	2016
dc.identifier.doi	10.1007/s11664-016-4753-5
dc.identifier.issn	0361-5235
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/26335
dc.source.beginpage	5449
dc.source.endpage	5455
dc.source.issue	10
dc.source.journal	Journal of Electronic Materials
dc.source.volume	45
dc.title	Application of self assembled monolayers to the electroless metallization of high aspect ratio vias for microelectronics
dc.type	Journal article
dspace.entity.type	Publication
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