Show simple item record

Heterogeneous system integration using silicon interposer and 3D stacking technology

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T10:06:55Z
dc.date.available2021-10-23T10:06:55Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26336
dc.sourceIIOimport
dc.titleHeterogeneous system integration using silicon interposer and 3D stacking technology
dc.typeMeeting abstract
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage502
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC
dc.source.conferencedate1/02/2016
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesForum presentation


Files in this item

Thumbnail
Name:
33644.pdf
Size:
67.45Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record