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Low warpage wafer level transfer molding post 3D die to wafer assembly

dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorWang, Teng
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorPotoms, Goedele
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorGal, Wilfred
dc.contributor.authorZijl, Jurrian
dc.contributor.authorKersjes, Sebastiaan
dc.contributor.authorWensink, Henk
dc.date.accessioned2021-10-23T10:11:06Z
dc.date.available2021-10-23T10:11:06Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26386
dc.sourceIIOimport
dc.titleLow warpage wafer level transfer molding post 3D die to wafer assembly
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage843
dc.source.endpage848
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545526/?arnumber=7545526
imec.availabilityPublished - imec


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