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B-spline X-ray diffraction imaging – rapid non-destructive measurement of die warpage in ball grid array packages

dc.contributor.authorCowley, A.
dc.contributor.authorIvankovic, A.
dc.contributor.authorWong, C.S
dc.contributor.authorBennett, N.S.
dc.contributor.authorDanilewsky, A.N.
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMcNally, P.J.
dc.date.accessioned2021-10-23T10:23:24Z
dc.date.available2021-10-23T10:23:24Z
dc.date.issued2016
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26482
dc.sourceIIOimport
dc.titleB-spline X-ray diffraction imaging – rapid non-destructive measurement of die warpage in ball grid array packages
dc.typeJournal article
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.source.peerreviewyes
dc.source.beginpage108
dc.source.endpage116
dc.source.journalMicroelectronics Reliability
dc.source.volume59
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271415302778
imec.availabilityPublished - imec


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