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Reliability challenges related to TSV integration and 3D stacking

dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorLi, Yunlong
dc.contributor.authorGuo, Wei
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCherman, Vladimir
dc.contributor.authorStucchi, Michele
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T10:23:51Z
dc.date.available2021-10-23T10:23:51Z
dc.date.issued2016
dc.identifier.issn2168-2355
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26485
dc.sourceIIOimport
dc.titleReliability challenges related to TSV integration and 3D stacking
dc.typeJournal article
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage37
dc.source.endpage45
dc.source.journalIEEE Design & Test
dc.source.issue3
dc.source.volume33
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7329942
imec.availabilityPublished - open access


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