Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Reliability challenges related to TSV integration and 3D stacking
Publication:
Reliability challenges related to TSV integration and 3D stacking
Copy permalink
Date
2016
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
31750.pdf
1.83 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Croes, Kristof
;
De Messemaeker, Joke
;
Li, Yunlong
;
Guo, Wei
;
Varela Pedreira, Olalla
;
Cherman, Vladimir
;
Stucchi, Michele
;
De Wolf, Ingrid
;
Beyne, Eric
Journal
IEEE Design & Test
Abstract
Description
Statistics
Views
1958
since deposited on 2021-10-23
1
last month
1
last week
Acq. date: 2026-02-25
Citations
Statistics
Views
1958
since deposited on 2021-10-23
1
last month
1
last week
Acq. date: 2026-02-25
Citations