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Articles
Reliability challenges related to TSV integration and 3D stacking
Publication:
Reliability challenges related to TSV integration and 3D stacking
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Date
2016
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Croes, Kristof
;
De Messemaeker, Joke
;
Li, Yunlong
;
Guo, Wei
;
Varela Pedreira, Olalla
;
Cherman, Vladimir
;
Stucchi, Michele
;
De Wolf, Ingrid
;
Beyne, Eric
Journal
IEEE Design & Test
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1956
since deposited on 2021-10-23
9
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Acq. date: 2026-01-10
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Views
1956
since deposited on 2021-10-23
9
last month
Acq. date: 2026-01-10
Citations