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Fast method for the prediction of the capacitance of via through-holes

dc.contributor.authorJegannathan, S.
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorVan den Berghe, S.
dc.date.accessioned2021-09-30T12:16:22Z
dc.date.available2021-09-30T12:16:22Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2651
dc.sourceIIOimport
dc.titleFast method for the prediction of the capacitance of via through-holes
dc.typeProceedings paper
dc.contributor.imecauthorDe Zutter, Daniel
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage140
dc.source.endpage143
dc.source.conferenceProceedings of the IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
dc.source.conferencedate26/10/1998
dc.source.conferencelocationWest Point, NY USA
imec.availabilityPublished - open access


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