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Liquid mediated direct bonding and bond propagation

dc.contributor.authorDubey, Vikas
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorO'Callaghan, John
dc.contributor.authorWillems, Kherim
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T10:42:21Z
dc.date.available2021-10-23T10:42:21Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26586
dc.sourceIIOimport
dc.titleLiquid mediated direct bonding and bond propagation
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorO'Callaghan, John
dc.contributor.imecauthorWillems, Kherim
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecWillems, Kherim::0000-0003-1341-1581
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference6th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764501
imec.availabilityPublished - open access


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