dc.contributor.author | El-Mekki, Zaid | |
dc.contributor.author | Philipsen, Harold | |
dc.contributor.author | Honore, Mia | |
dc.contributor.author | Radisic, Alex | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Arnold, Marco | |
dc.contributor.author | Fluegel, Alexander | |
dc.contributor.author | Shu-Ya Chang, Iris | |
dc.contributor.author | Struyf, Herbert | |
dc.contributor.author | Mayer, Dieter | |
dc.date.accessioned | 2021-10-23T10:44:43Z | |
dc.date.available | 2021-10-23T10:44:43Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26597 | |
dc.source | IIOimport | |
dc.title | Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | El-Mekki, Zaid | |
dc.contributor.imecauthor | Philipsen, Harold | |
dc.contributor.imecauthor | Radisic, Alex | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.orcidimec | Philipsen, Harold::0000-0002-5029-1104 | |
dc.contributor.orcidimec | El-Mekki, Zaid::0000-0002-9851-9139 | |
dc.contributor.orcidimec | Struyf, Herbert::0000-0002-6782-5424 | |
dc.source.peerreview | yes | |
dc.source.conference | 13th Annual International Wafer-Level Packaging Conference - IWLPC | |
dc.source.conferencedate | 18/10/2016 | |
dc.source.conferencelocation | San Jose, CA USA | |
imec.availability | Published - imec | |