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3D TSV based high frequency components for RF IC and RF MEMS applications

dc.contributor.authorFernandez-Bolanos, Montserrat
dc.contributor.authorVitale, Wolfgang
dc.contributor.authorMaqueda Lopez, Mariazel
dc.contributor.authorIonescu, Adrian M.
dc.contributor.authorOcket, Ilja
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorKlumpp, Armin
dc.contributor.authorMerkel, R.
dc.contributor.authorWeber, J.
dc.contributor.authorRamm, P.
dc.contributor.authorEnayati, Amin
dc.date.accessioned2021-10-23T10:47:58Z
dc.date.available2021-10-23T10:47:58Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26612
dc.sourceIIOimport
dc.title3D TSV based high frequency components for RF IC and RF MEMS applications
dc.typeProceedings paper
dc.contributor.imecauthorOcket, Ilja
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE 3D System Integration Conference - 3DIC
dc.source.conferencedate9/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970030/
imec.availabilityPublished - open access


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