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Methodologies to mitigate package induced stresses in the BEOL

dc.contributor.authorGonzalez, Mario
dc.contributor.authorKljucar, Luka
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T10:58:14Z
dc.date.available2021-10-23T10:58:14Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26654
dc.sourceIIOimport
dc.titleMethodologies to mitigate package induced stresses in the BEOL
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage7
dc.source.conferenceElectronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764490
imec.availabilityPublished - imec


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