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Innovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control

dc.contributor.authorGunay Demirkol, Anil
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorHéraud, Stéphane
dc.contributor.authorGodny, Stephane
dc.contributor.authorCharley, Anne-Laure
dc.contributor.authorLeray, Philippe
dc.contributor.authorUrenski, Ronen
dc.contributor.authorCohen, Oded
dc.contributor.authorTurovets, Igor
dc.contributor.authorWolfling, Shay
dc.date.accessioned2021-10-23T11:03:11Z
dc.date.available2021-10-23T11:03:11Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26673
dc.sourceIIOimport
dc.titleInnovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control
dc.typeProceedings paper
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorCharley, Anne-Laure
dc.contributor.imecauthorLeray, Philippe
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage977807
dc.source.conferenceMetrology, Inspection, and Process Control for Microlithography XXX
dc.source.conferencedate21/02/2016
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=2507368
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 9778


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