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Electrochemical deposition seeding mechanisms of CuNi-alloys (for novel chip technologies)

dc.contributor.authorHaesevoets, Karel
dc.contributor.authorVereecken, Philippe
dc.contributor.authorRadisic, Alex
dc.date.accessioned2021-10-23T11:04:50Z
dc.date.available2021-10-23T11:04:50Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26680
dc.sourceIIOimport
dc.titleElectrochemical deposition seeding mechanisms of CuNi-alloys (for novel chip technologies)
dc.typeMeeting abstract
dc.contributor.imecauthorHaesevoets, Karel
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorRadisic, Alex
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.conferenceChemical Research in Flanders - CRF-1
dc.source.conferencedate24/10/2016
dc.source.conferencelocationBlankenberge Belgium
imec.availabilityPublished - imec


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