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Impact of ELD layers in mechanical properties of microbumps for 3D stacking

dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDe Preter, Inge
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-23T11:19:56Z
dc.date.available2021-10-23T11:19:56Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26738
dc.sourceIIOimport
dc.titleImpact of ELD layers in mechanical properties of microbumps for 3D stacking
dc.typeProceedings paper
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference6th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764712
imec.availabilityPublished - open access


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