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Rapid recovery process of plasma damaged porous low-k dielectrics by wet surface modifying treatment

dc.contributor.authorIwasaki, A,
dc.contributor.authorHiguchi, A.
dc.contributor.authorKomori, K.
dc.contributor.authorSato, M.
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-23T11:29:33Z
dc.date.available2021-10-23T11:29:33Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26771
dc.sourceIIOimport
dc.titleRapid recovery process of plasma damaged porous low-k dielectrics by wet surface modifying treatment
dc.typeProceedings paper
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewyes
dc.source.beginpage223
dc.source.endpage226
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces XIII - UCPSS
dc.source.conferencedate11/09/2016
dc.source.conferencelocationKnokke Belgium
dc.identifier.urlhttp://www.scientific.net/SSP.255.223
imec.availabilityPublished - imec


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