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Uniform large-area slot-die coating of soluble metal oxide semiconductor towards mass production of high-performance TFT backplanes

dc.contributor.authorKatsouras, lias
dc.contributor.authorMaas, Joris
dc.contributor.authorvan der Steen, Jan Laurens
dc.contributor.authorGelinck, Gerwin
dc.contributor.authorTakata, Ryo
dc.contributor.authorMarinkovic, Marko
dc.contributor.authorNeumann, Anita
dc.contributor.authorPham, Duy-Vu
dc.contributor.authorAnselmann, Ralf
dc.contributor.authorKe, Tung Huei
dc.contributor.authorSmout, Steve
dc.contributor.authorSchols, Sarah
dc.date.accessioned2021-10-23T11:41:13Z
dc.date.available2021-10-23T11:41:13Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26810
dc.sourceIIOimport
dc.titleUniform large-area slot-die coating of soluble metal oxide semiconductor towards mass production of high-performance TFT backplanes
dc.typeProceedings paper
dc.contributor.imecauthorMaas, Joris
dc.contributor.imecauthorKe, Tung Huei
dc.contributor.imecauthorSmout, Steve
dc.contributor.imecauthorSchols, Sarah
dc.contributor.orcidimecKe, Tung Huei::0000-0001-8381-4998
dc.contributor.orcidimecSmout, Steve::0000-0001-5464-8951
dc.source.peerreviewyes
dc.source.conference23rd International Display Workshops - IDW
dc.source.conferencedate7/12/2016
dc.source.conferencelocationFukuoka Japan
imec.availabilityPublished - imec


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